By integrating the three distinct technologies of silicon photonics, electronics and active photonics, we’re giving data centers what they need to meet tomorrow’s demands.
The DIMENSION project is coordinated by Dresden University of Technology and involves partners from Germany, Switzerland, Greece and the UK. The two research centers included are Innovations for High Performance Microelectronics and Athens Information Technology. The large industry partners are ADVA Optical Networking, Optocap and IBM Research – Zurich. The project aims to take electro-optical integration to a new level by producing silicon chips built with active laser components. The consortium of partners also forms a complete value chain for the production of the new technology, from research through to innovative package design and assembly. The project will run until the end of January 2020.
“Improving efficiency in the DCI couldn’t be more vital given the increasing demand for cloud computing and the growing scale of the internet of things,” commented Michael Eiselt, director, advanced technology, ADVA Optical Networking. “Much of our recent innovation has centered on enhancing the DCI, such as our FSP 3000 CloudConnect™ solution. By integrating the three distinct technologies of silicon photonics, electronics and active photonics, we’re giving data centers what they need to meet tomorrow’s demands. It’s great to be working closely with other European companies and institutions to make this vital breakthrough a reality. It also provides fantastic opportunities for university students who get to be at the forefront of innovation and help make a significant impact on the industry.”